作为富士康HDI板授权代理销售商，自2007年以来, 一直秉持明确的市场定位, 秉承诚信, 专业,
负责的商业理念，受到广大手机厂商客户的一致好评.
|
|
Manufacturing Capability Summary |
|
|
|
Unit: um |
2008 |
|
2009 |
|
|
Production |
|
Prototype |
|
Production |
|
Prototype |
|
Min. Line/Spacing Global |
75/75 |
|
65/65 |
|
75/75 |
|
50/50 |
|
Min. Line/Spacing Localized |
65/75 |
|
60/60 |
|
50/50 |
|
50/50 |
|
Critical Line width/Tolerance |
75/20% |
|
60/15% |
|
60/15% |
|
50/10% |
|
Min. Microvia Drill size |
100 |
|
100 |
|
75 |
|
75 |
|
Min. Capture / Target Pad Size |
250 |
|
200 |
|
200 |
|
150 |
|
PTH & Buried drill Size |
250 |
|
200 |
|
200 |
|
200 |
|
PTH Pad Size |
450 |
|
400 |
|
350 |
|
350 |
|
Max. PTH Aspect Ratio |
8:1 |
|
10:1 |
|
10:1 |
|
12:1 |
|
Max. Micro-via Aspect Ratio |
0.8:1 |
|
0.8:1 |
|
0.8:1 |
|
0.8:1 |
|
Max. Build-up Layer Count Per Side |
3+N+3 |
|
Anylayer |
|
Anylayer |
|
Anylayer |
|
Max. Overall Thickness |
1600 |
|
1800 |
|
2000 |
|
2000 |
|
Solder Mask Clearance |
50 |
|
37 |
|
37 |
|
25 |
|
Solder Mask Web |
75 |
|
75 |
|
50 |
|
50 |
|
Min. CSP/BGA Pitch |
500 |
|
400 |
|
400 |
|
400 |
|
Impedance Control % |
± 10 |
|
± 7 |
|
± 7 |
|
± 5 |
|
|
|
|
|
|
|
|
|
|
Material |
|
|
Surface Finish |
|
FR4 Normal Tg/Mid Tg |
|
|
|
|
FR4 Tg=170【Lead free】 |
|
|
Selective ENIG + OSP |
|
Phenolic / Dicy cure FR4 |
|
|
High Temp OSP |
|
Halogen free |
|
|
ImmersionSilver |
|
RCC |
|
|
Carbon + OSP |
|
Ultra Thin Core/PWB |
|
|
Immersion Tin |
|
Low Dk/High Speed Material |
|
|
|
|
